• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The bath is free of cyanide and contains the gold in the form of a thiosulphato complex. In this bath, gold is electrodeposited as a levelling, non-porous layer at pH values between 4 and 13 and at temperatures between 10 and 80 DEG C with a current between 0.1 and 2 A/dm<2> onto a suitable substrate.
    公开号:SU923375A3
    申请号:SU752172438
    申请日:1975-09-17
    公开日:1982-04-23
    发明作者:Людвиг Рольф；Кулькович Йозеф
    申请人:Шеринг Аг (Инофирма)；
    IPC主号:
    专利说明:

    Sodium dithiosulfate (N33GAi (5120) 7 ZHiiO) is half-reduced, for example, by reduction of sodium tetrachloroaurate in a neutral aqueous solution with thiosulfate and by precipitating the formed complexes with alcohol. In a similar way, sodium hepta-thiosulfato diaaurate (, j (Si03) 7J) is obtained. When using the proposed electrolytes with the same concentration of gold as in the known electrolyte but with a significant excess of thiosulfate used as the complexing agent, for example, at a ratio of Na3Au (S (,) - 1: 5), the electrolyte remains stable almost infinitely. the fact that gold is difficult to dissolve in thiosulfate solutions is necessary to apply insoluble anodes. Therefore, a reducing agent — sodium sulfite, () or a mixture of potassium pyrosulfate ((2P5) —– is used to adjust the pH of the electrolyte). A mixture of boric acid and ethylene glycol is used. Using the proposed electrolyte, brilliant coatings are obtained already at a thickness of 2.5 µm, containing only 0-2 ores / dm (electrographic test), which makes it possible to consider such coatings as porous. Coatings of varying hardness (from 70 to 180 according to Vickers) depending on the ratio of () (to excess thiosulfate in solution and with increasing current density, as illustrated in table. 1. The coatings deposited from the proposed electrolyte possess, even at an increased thickness of the coating, a good ductility. At the same time, the electrolyte has, already beginning with a coating thickness of 3 µm, a leveling effect and is therefore suitable for producing both thin and thick gold coatings. The use of low current density (0.1-0.5 A / dm) provides high-purity gold coatings with high electrical conductivity. At a current density of 0, - 1.2 A / dm, coatings of increased hardness and wear resistance are obtained. The invention is illustrated by several examples presented in Table. 2. Smooth glossy (reflective ability is 9b%) non-porous tires with a thickness of 0.220 µm with a flow output of 95-100, electrical resistivity of which is 0.026-0.030 Om.mm / m, and weight (percentage of elongation) are deposited from this electrolyte 10%; Electrolyte dispersion capacity (according to Hering) is 50-701. The coatings are easy to solder and fall well after several months of storage. The electrolyte can also operate at elevated temperatures, which allows deposition at current densities of up to 1.5 A / dm, while maintaining a 100% current output. This is particularly advantageous in cases where a gold coating of very high ductility with extremely low porosity is required. Deposition is carried out both in stationary baths and in drums. Electrolyte mixing and cathode movement can be used. Thus, the invention allows to obtain gold coatings of good quality. Electrolyte is stable in operation. Working with electrolyte is completely harmless, because it does not emit any toxic or corrosive vapors. The proposed electrolyte allows gold to be deposited in a wide pH range (from "to 13) and, due to this, it is only in the acidic pH range that it has the best scattering power is known to increase with increasing pH. The current output is independent of the current density and is almost 100-5. As a consequence, there is no release of hydrogen. A wide pH range and the absence of hydrogen evolution create a generally favorable prerequisite for the application of the proposed electrolyte in the manufacture of printed circuits. The resist or protective lacquers used in printed circuits are otherwise subject to aggression or separated under the influence of released hydrogen, which is completely unacceptable.
    Table 1
    () ll 0 (5.0 7
    权利要求:
    Claims (1)
    [1]
    Invention Formula
    Gilding electrolyte containing gold thiosulfate complex, mainly sodium dithiosulfate or sodium hepta-thiosulfate diadeutrate, sodium or potassium thiosulfate and a buffer additive, characterized in that, in order to reduce the porosity of the coatings and increase the stability of the electrolyte, it is additional content.
    9.85
    15.7 2kQ
    A resuscitator lives — sodium sulphite or a mixture of sodium sulphite and potassium pierss sulphite, and as a buffer additive a mixture of boric acid and ethylene glycol at the following ratio of components, g / l:
    Sodium dithiosulfate or heptadiosulfate diaaudate (in terms of metal) 7 Sodium or potassium thiosulfate Sodium sulfite Potassium pyrosulfite Borna acid Ethylene glycol 15b-2 is taken into account in the examination. SafarzynskfS. and others. Thiosul2, 2-fold electrolytic gold plating. - Pe18, 65, the effective journal Himi, And 12, 37.21975, p. 12L255. 9233758 Sources of Information,
    类似技术:
    公开号 | 公开日 | 专利标题
    US4428802A|1984-01-31|Palladium-nickel alloy electroplating and solutions therefor
    US3677909A|1972-07-18|Palladium-nickel alloy plating bath
    JP3302949B2|2002-07-15|Black ruthenium plating solution
    KR940001679B1|1994-03-05|Electrodeposition of palladium films
    EP3159435B1|2018-05-23|Additive for silver palladium alloy electrolytes
    SU923375A3|1982-04-23|Gold plating electrolyte
    JP2003535222A|2003-11-25|Electrolyte and method for electrodepositing a tin-silver alloy layer
    Watson et al.1986|The role of chromium II and VI in the electrodeposition of chromium nickel alloys from trivalent chromium—amide electrolytes
    CA1062650A|1979-09-18|Method and composition for plating palladium
    US3920526A|1975-11-18|Process for the electrodeposition of ductile palladium and electroplating bath useful therefor
    US4448648A|1984-05-15|Trivalent chromium electroplating baths
    GB2046794A|1980-11-19|Silver and gold/silver alloy plating bath and method
    JP2001172790A|2001-06-26|Electroplating bath for nickel plating
    US4155817A|1979-05-22|Low free cyanide high purity silver electroplating bath and method
    CA1243982A|1988-11-01|Gold plating bath containing tartrate and carbonatesalts
    NL8104859A|1982-05-17|METHOD OF APPLYING A LOW GOLD.
    Reinheimer1974|Carbon in Gold Electrodeposits
    US3984291A|1976-10-05|Electrodeposition of tin-lead alloys and compositions therefor
    US4401527A|1983-08-30|Process for the electrodeposition of palladium
    US4411744A|1983-10-25|Bath and process for high speed nickel electroplating
    JPH09170094A|1997-06-30|Tin-silver alloy acidic plating bath
    Afifi et al.1987|Additive behavior in copper electrorefining
    CA1180677A|1985-01-08|Bath and process for high speed nickel electroplating
    US2439935A|1948-04-20|Indium electroplating
    Kristev et al.1986|Structure of silver electrodeposits plated from different complex electrolytes
    同族专利:
    公开号 | 公开日
    YU36050B|1981-11-13|
    IE41859B1|1980-04-09|
    SE408436B|1979-06-11|
    FR2285473A1|1976-04-16|
    NL7511062A|1976-03-23|
    IE41859L|1976-03-20|
    AT335813B|1977-04-12|
    RO69581A|1980-08-15|
    GB1526215A|1978-09-27|
    JPS5147539A|1976-04-23|
    DE2445537A1|1976-04-08|
    DD118124A5|1976-02-12|
    SE7510455L|1976-03-22|
    YU106175A|1981-04-30|
    AR206828A1|1976-08-23|
    BR7505838A|1976-08-03|
    CS181784B2|1978-03-31|
    IT1042698B|1980-01-30|
    FR2285473B1|1979-06-22|
    ZA755978B|1976-08-25|
    AU8506575A|1977-03-31|
    ATA722575A|1976-07-15|
    HU172424B|1978-08-28|
    CH614240A5|1979-11-15|
    CA1053174A|1979-04-24|
    ES438407A1|1977-02-01|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    JPS5513318B2|1973-12-27|1980-04-08|JPS6217233B2|1979-05-29|1987-04-16|Matsushita Electric Ind Co Ltd|
    JPS5845026B2|1979-05-29|1983-10-06|Matsushita Electric Ind Co Ltd|
    DE4226167C2|1992-08-07|1996-10-24|Sel Alcatel Ag|Method for electrically conductive connection using flip-chip technology|
    DE19546325C1|1995-12-12|1997-06-05|Benckiser Knapsack Ladenburg|Process for coloring ceramic surfaces|
    WO2003076695A1|2002-03-13|2003-09-18|Mitsubishi Chemical Corporation|Gold plating solution and method for gold plating|
    CN108441901A|2018-04-18|2018-08-24|中国工程物理研究院激光聚变研究中心|A kind of gold-plating solution of no cyanogen organic solvent|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    DE19742445537|DE2445537A1|1974-09-20|1974-09-20|BATH FOR GALVANIC DEPOSITION OF GOLD|
    [返回顶部]